Wafer slicing is an essential process in semiconductor chip manufacturing process, which is the last process in wafer manufacturing.

The splitting of a finished wafer into individual chips (grains) based on the size of the chip is called a wafer slicing.

The rapid development of optoelectronics industry in recent years.

The demand for high integration and high performance semiconductor wafers is increasing.

Silicon, silicon carbide, sapphire, glass and indium phosphide are widely used as substrate materials for semiconductor wafers.

With the increase of wafer integration, wafers tend to be thin and light, and many traditional processing methods are no longer applicable.

Therefore, laser stealth cutting technology is introduced in some processes.